STMicroelectronics STDRIVEG600W

STMicroelectronics STDRIVEG600W electronic component product image

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Manufacturer
Manufacturer No
STDRIVEG600W
Package
Die
Packaging
Bulk
Description
IC GATE DRVR HALF-BRIDGE DIE
Detailed Description
Half-Bridge Gate Driver IC Non-Inverting Wafer
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Series
-
Gate Type
GaN FET, MOSFET (N-Channel)
Packaging
Bulk
Input Type
Non-Inverting
Channel Type
Independent
Manufacturer
STMicroelectronics
Mounting Type
Surface Mount
Package / Case
Die
Voltage - Supply
4.75V ~ 20V
Number of Drivers
2
Base Product Number
STDRIVEG600
Driven Configuration
Half-Bridge
Operating Temperature
-40°C ~ 125°C (TJ)
Rise / Fall Time (Typ)
7ns, 5ns
Supplier Device Package
Wafer
Logic Voltage - VIL, VIH
1.45V, 2V
High Side Voltage - Max (Bootstrap)
620 V
Current - Peak Output (Source, Sink)
5.5A, 6A
AttributeValue
Series-
Gate TypeGaN FET, MOSFET (N-Channel)
PackagingBulk
Input TypeNon-Inverting
Channel TypeIndependent
ManufacturerSTMicroelectronics
Mounting TypeSurface Mount
Package / CaseDie
Voltage - Supply4.75V ~ 20V
Number of Drivers2
Base Product NumberSTDRIVEG600
Driven ConfigurationHalf-Bridge
Operating Temperature-40°C ~ 125°C (TJ)
Rise / Fall Time (Typ)7ns, 5ns
Supplier Device PackageWafer
Logic Voltage - VIL, VIH1.45V, 2V
High Side Voltage - Max (Bootstrap)620 V
Current - Peak Output (Source, Sink)5.5A, 6A

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Packaging Process

Product before packing
Step1: Product
Product in vacuum packaging
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-Static Bag
Individual packaging box
Step4: Package Boxes
Packaging box with shipping label
Step5: Bar-Code Shipping Tags
Shipping by cargo vessel
Step6: Shipping