STMicroelectronics LDL112PV18R
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| Attribute | Value |
|---|---|
| HTS | COMPONENTS |
| PPAP | No |
| Type | LDO |
| EU RoHS | Compliant |
| Mounting | Surface Mount |
| Polarity | Positive |
| ECCN (US) | EAR99 |
| Packaging | Tape and Reel |
| Pin Count | 6 |
| Automotive | No |
| Lead Shape | No Lead |
| Output Type | Fixed |
| PCB changed | 6 |
| Accuracy (%) | ±2 |
| Availability | In Stock (cut strips) |
| Package Width | 3 |
| Package Height | 0.95(Max) |
| Package Length | 3 |
| Line Regulation | 0.01%/V |
| Load Regulation | 30mA |
| Special Features | Thermal Shutdown Protection|Current Limit |
| Supplier Package | DFN EP |
| Number of Outputs | 1 |
| Output Voltage (V) | 1.8 |
| Standard Package Name | DFN |
| Manufacturer Lead Time | 30 weeks |
| Maximum Input Voltage (V) | 5.5 |
| Minimum Input Voltage (V) | 1.6 |
| Maximum Output Current (A) | 1.2 |
| Maximum Quiescent Current (mA) | 0.07 |
| Maximum Operating Temperature (°C) | 125 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Dropout Voltage @ Current (V) | [email protected] |
| Maximum Junction Case Thermal Resistance | 10°C/W |
| Maximum Junction Ambient Thermal Resistance | 55°C/W |
Purchase & Inquiry
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Packaging Process
