STMicroelectronics IMP23ABSUTR

STMicroelectronics IMP23ABSUTR electronic component product image

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Manufacturer
Manufacturer No
IMP23ABSUTR
Packaging
Tape & Reel (TR); Cut Tape (CT)
Description
MIC MEMS ANALOG OMNI -38DB
Detailed Description
35 Hz ~ 80 kHz Analog Microphone MEMS (Silicon) 1.52 V ~ 3.6 V Omnidirectional (-38db ±1dB) Solder Pads
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Type
MEMS (Silicon)
Shape
Rectangle
Series
-
Direction
Omnidirectional
Packaging
Tape & Reel (TR); Cut Tape (CT)
S/N Ratio
64dB
Output Type
Analog
Sensitivity
-38db ±1dB
Termination
Solder Pads
Height (Max)
0.039" (0.98mm)
Manufacturer
STMicroelectronics
Port Location
Bottom
Voltage Range
1.52 V ~ 3.6 V
Frequency Range
35 Hz ~ 80 kHz
Voltage - Rated
2.75 V
Current - Supply
150 µA
Size / Dimension
0.130" L x 0.097" W (3.31mm x 2.46mm)
Base Product Number
IMP23
AttributeValue
TypeMEMS (Silicon)
ShapeRectangle
Series-
DirectionOmnidirectional
PackagingTape & Reel (TR); Cut Tape (CT)
S/N Ratio64dB
Output TypeAnalog
Sensitivity-38db ±1dB
TerminationSolder Pads
Height (Max)0.039" (0.98mm)
ManufacturerSTMicroelectronics
Port LocationBottom
Voltage Range1.52 V ~ 3.6 V
Frequency Range35 Hz ~ 80 kHz
Voltage - Rated2.75 V
Current - Supply150 µA
Size / Dimension0.130" L x 0.097" W (3.31mm x 2.46mm)
Base Product NumberIMP23

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Packaging Process

Product before packing
Step1: Product
Product in vacuum packaging
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-Static Bag
Individual packaging box
Step4: Package Boxes
Packaging box with shipping label
Step5: Bar-Code Shipping Tags
Shipping by cargo vessel
Step6: Shipping