10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

SMART Modular Technologies KTDMAG4B632BGCBAT

SMART Modular Technologies KTDMAG4B632BGCBAT electronic component product image

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Manufacturer No
KTDMAG4B632BGCBAT
Description
DRAM Chip DDR4 SDRAM 16Gbit 1Gx16 1.2V
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
DRAM Type
DDR4 SDRAM
ECCN (US)
EAR99
Availability
No Stock Available
Organization
1Gx16
Interface Type
POD
Chip Density (bit)
16G
Data Bus Width (bit)
16
Manufacturer Lead Time
2 weeks
Operating Current (mA)
195
Address Bus Width (bit)
19
Maximum Access Time (ns)
0.16
Maximum Clock Rate (MHz)
3200
Number of Internal Banks
2
Number of Words per Bank
512M
Number of Bits/Word (bit)
16
Number of I/O Lines (bit)
16
Supplier Temperature Grade
Commercial
Maximum Operating Temperature (°C)
95
Minimum Operating Temperature (°C)
0
Maximum Operating Supply Voltage (V)
1.26
Minimum Operating Supply Voltage (V)
1.14
AttributeValue
DRAM TypeDDR4 SDRAM
ECCN (US)EAR99
AvailabilityNo Stock Available
Organization1Gx16
Interface TypePOD
Chip Density (bit)16G
Data Bus Width (bit)16
Manufacturer Lead Time2 weeks
Operating Current (mA)195
Address Bus Width (bit)19
Maximum Access Time (ns)0.16
Maximum Clock Rate (MHz)3200
Number of Internal Banks2
Number of Words per Bank512M
Number of Bits/Word (bit)16
Number of I/O Lines (bit)16
Supplier Temperature GradeCommercial
Maximum Operating Temperature (°C)95
Minimum Operating Temperature (°C)0
Maximum Operating Supply Voltage (V)1.26
Minimum Operating Supply Voltage (V)1.14

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Important Notes

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2. Product availability and pricing may change over time. Our sales manager will verify the details of your order and contact you if any changes or confirmation are required.

Packaging Process