SMART Modular Technologies KTDM8G4B632BGIBCT
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| Attribute | Value |
|---|---|
| PPAP | No |
| EU RoHS | Compliant |
| Mounting | Surface Mount |
| DRAM Type | DDR4 SDRAM |
| ECCN (US) | EAR99 |
| Pin Count | 96 |
| Automotive | No |
| PCB changed | 96 |
| Availability | No Stock Available |
| Organization | 512Mx16 |
| Package Width | 7.5 |
| Interface Type | POD |
| Package Length | 13.3 |
| Supplier Package | BGA |
| Chip Density (bit) | 8G |
| Data Bus Width (bit) | 16 |
| Standard Package Name | BGA |
| Manufacturer Lead Time | 2 weeks |
| Operating Current (mA) | 201 |
| Address Bus Width (bit) | 18 |
| Maximum Access Time (ns) | 0.16 |
| Maximum Clock Rate (MHz) | 3200 |
| Number of Internal Banks | 2 |
| Number of Words per Bank | 256M |
| Number of Bits/Word (bit) | 16 |
| Number of I/O Lines (bit) | 16 |
| Supplier Temperature Grade | Industrial |
| Maximum Operating Temperature (°C) | 85 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Supply Voltage (V) | 1.26 |
| Minimum Operating Supply Voltage (V) | 1.14 |
Purchase & Inquiry
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We suggest submitting an RFQ to get the most up-to-date pricing and availability for the components you are looking for. Our sales team will reply by email within 24 hours.
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2. Product availability and pricing may change over time. Our sales manager will verify the details of your order and contact you if any changes or confirmation are required.
Packaging Process
