Silicon Labs TS7003ITD833

Silicon Labs TS7003ITD833 electronic component product image

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Manufacturer
Manufacturer No
TS7003ITD833
Package
8-WDFN Exposed Pad
Packaging
Strip
Description
IC ADC 12BIT 8-TDFN
Detailed Description
12 Bit Analog to Digital Converter 1 Input 1 SAR 8-TDFN (3x3)
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Series
-
Features
-
Packaging
Strip
Input Type
Single Ended
Architecture
SAR
Manufacturer
Silicon Labs
Configuration
S/H-ADC
Mounting Type
Surface Mount
Data Interface
SPI
Number of Bits
12
Package / Case
8-WDFN Exposed Pad
Reference Type
Internal
Ratio - S/H:ADC
1:1
Number of Inputs
1
Operating Temperature
-40°C ~ 85°C
Supplier Device Package
8-TDFN (3x3)
Number of A/D Converters
1
Voltage - Supply, Analog
2.7V ~ 3.6V
Voltage - Supply, Digital
2.7V ~ 3.6V
Sampling Rate (Per Second)
300k
AttributeValue
Series-
Features-
PackagingStrip
Input TypeSingle Ended
ArchitectureSAR
ManufacturerSilicon Labs
ConfigurationS/H-ADC
Mounting TypeSurface Mount
Data InterfaceSPI
Number of Bits12
Package / Case8-WDFN Exposed Pad
Reference TypeInternal
Ratio - S/H:ADC1:1
Number of Inputs1
Operating Temperature-40°C ~ 85°C
Supplier Device Package8-TDFN (3x3)
Number of A/D Converters1
Voltage - Supply, Analog2.7V ~ 3.6V
Voltage - Supply, Digital2.7V ~ 3.6V
Sampling Rate (Per Second)300k

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Packaging Process

Product before packing
Step1: Product
Product in vacuum packaging
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-Static Bag
Individual packaging box
Step4: Package Boxes
Packaging box with shipping label
Step5: Bar-Code Shipping Tags
Shipping by cargo vessel
Step6: Shipping