10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

Sensata Technologies ODC15

Sensata Technologies ODC15 electronic component product image

Image is only for reference

Manufacturer No
ODC15
Description
I/O Module Relays Output Module 15VDC-IN 20mA 4000Vrms Thru-Hole/Plug-In
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
PPAP
No
EU RoHS
Compliant
Mounting
Through Hole/Plug-In
ECCN (US)
EAR99
Automotive
No
Input Type
DC
Technology
Solid State
Module Type
Output Module
Output Type
DC
Availability
In Stock
Maximum Load Current
3A
Maximum Load Voltage
60VDC
Minimum Load Voltage
3VDC
I/O Isolation Voltage
4000Vrms
Maximum Input Current
20mA
Maximum Input Voltage
20VDC
Minimum Input Voltage
10VDC
Typical Input Voltage
15VDC
Maximum Operating Temperature (°C)
80
Minimum Operating Temperature (°C)
-30
AttributeValue
PPAPNo
EU RoHSCompliant
MountingThrough Hole/Plug-In
ECCN (US)EAR99
AutomotiveNo
Input TypeDC
TechnologySolid State
Module TypeOutput Module
Output TypeDC
AvailabilityIn Stock
Maximum Load Current3A
Maximum Load Voltage60VDC
Minimum Load Voltage3VDC
I/O Isolation Voltage4000Vrms
Maximum Input Current20mA
Maximum Input Voltage20VDC
Minimum Input Voltage10VDC
Typical Input Voltage15VDC
Maximum Operating Temperature (°C)80
Minimum Operating Temperature (°C)-30

Purchase & Inquiry

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RFQ (Request for Quote)

We suggest submitting an RFQ to get the most up-to-date pricing and availability for the components you are looking for. Our sales team will reply by email within 24 hours.

Important Notes

1. An email containing your order details will be sent to your inbox. If you cannot find it, please check your spam or junk mail folder.

2. Product availability and pricing may change over time. Our sales manager will verify the details of your order and contact you if any changes or confirmation are required.

Packaging Process