10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

Seco RD18-3341-3111-I2

Seco RD18-3341-3111-I2 electronic component product image

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Manufacturer
Manufacturer No
RD18-3341-3111-I2
Packaging
Bulk
Description
SOM SMARC D18 I.MX8M QC 4GB
Detailed Description
i.MX 8M Embedded Module ARM® Cortex®-A53, ARM® Cortex®-M7 800MHz, 1.8GHz 4GB 32GB
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Speed
800MHz, 1.8GHz
Series
i.MX 8M
RAM Size
4GB
Packaging
Bulk
Flash Size
32GB
Co-Processor
-
Manufacturer
Seco
Connector Type
USB
Core Processor
ARM® Cortex®-A53, ARM® Cortex®-M7
Size / Dimension
2.760" L x 1.570" W (70.00mm x 40.00mm)
Module/Board Type
MPU Core
Operating Temperature
-40°C ~ 85°C
AttributeValue
Speed800MHz, 1.8GHz
Seriesi.MX 8M
RAM Size4GB
PackagingBulk
Flash Size32GB
Co-Processor-
ManufacturerSeco
Connector TypeUSB
Core ProcessorARM® Cortex®-A53, ARM® Cortex®-M7
Size / Dimension2.760" L x 1.570" W (70.00mm x 40.00mm)
Module/Board TypeMPU Core
Operating Temperature-40°C ~ 85°C

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2. Product availability and pricing may change over time. Our sales manager will verify the details of your order and contact you if any changes or confirmation are required.

Packaging Process