10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

Samsung Electronics KLM8G1GEME-B0410

Samsung Electronics KLM8G1GEME-B0410 electronic component product image

Image is only for reference

Manufacturer No
KLM8G1GEME-B0410
Package
FBGA
Description
Flash Serial e-MMC 1.8V/3.3V 64G-bit 153-Pin FBGA
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
HTS
8542.32.00.71
PPAP
No
EU RoHS
Supplier Unconfirmed
Mounting
Surface Mount
ECCN (US)
3A991.b.1.a
Pin Count
153
Automotive
No
PCB changed
153
Timing Type
Synchronous
Availability
No Stock Available
Package Width
11.5
Interface Type
Serial e-MMC
Package Length
13
Programmability
Yes
Supplier Package
FBGA
Chip Density (bit)
64G
Standard Package Name
BGA
Maximum Operating Temperature (°C)
85
Minimum Operating Temperature (°C)
-25
Typical Operating Supply Voltage (V)
1.8|3.3
AttributeValue
HTS8542.32.00.71
PPAPNo
EU RoHSSupplier Unconfirmed
MountingSurface Mount
ECCN (US)3A991.b.1.a
Pin Count153
AutomotiveNo
PCB changed153
Timing TypeSynchronous
AvailabilityNo Stock Available
Package Width11.5
Interface TypeSerial e-MMC
Package Length13
ProgrammabilityYes
Supplier PackageFBGA
Chip Density (bit)64G
Standard Package NameBGA
Maximum Operating Temperature (°C)85
Minimum Operating Temperature (°C)-25
Typical Operating Supply Voltage (V)1.8|3.3

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Packaging Process