ROHM Semiconductor RF1001T2DNZC9

ROHM Semiconductor RF1001T2DNZC9 electronic component product image

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Manufacturer
Manufacturer No
RF1001T2DNZC9
Quantity
30
Availability
In Stock
Package
TO-220-3 Full Pack
Packaging
Tube
Description
DIODE ARRAY GP 200V 10A TO-220FN
Detailed Description
Diode Array 1 Pair Common Cathode 200 V 10A Through Hole TO-220-3 Full Pack
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Speed
Fast Recovery =< 500ns, > 200mA (Io)
Series
-
Packaging
Tube
Technology
Standard
Manufacturer
Rohm Semiconductor
Mounting Type
Through Hole
Package / Case
TO-220-3 Full Pack
Base Product Number
RF1001
Diode Configuration
1 Pair Common Cathode
Supplier Device Package
TO-220FN
Reverse Recovery Time (trr)
30 ns
Current - Reverse Leakage @ Vr
10 µA @ 200 V
Voltage - DC Reverse (Vr) (Max)
200 V
Operating Temperature - Junction
150°C
Voltage - Forward (Vf) (Max) @ If
930 mV @ 5 A
Current - Average Rectified (Io) (per Diode)
10A
AttributeValue
SpeedFast Recovery =< 500ns, > 200mA (Io)
Series-
PackagingTube
TechnologyStandard
ManufacturerRohm Semiconductor
Mounting TypeThrough Hole
Package / CaseTO-220-3 Full Pack
Base Product NumberRF1001
Diode Configuration1 Pair Common Cathode
Supplier Device PackageTO-220FN
Reverse Recovery Time (trr)30 ns
Current - Reverse Leakage @ Vr10 µA @ 200 V
Voltage - DC Reverse (Vr) (Max)200 V
Operating Temperature - Junction150°C
Voltage - Forward (Vf) (Max) @ If930 mV @ 5 A
Current - Average Rectified (Io) (per Diode)10A

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Packaging Process

Product before packing
Step1: Product
Product in vacuum packaging
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-Static Bag
Individual packaging box
Step4: Package Boxes
Packaging box with shipping label
Step5: Bar-Code Shipping Tags
Shipping by cargo vessel
Step6: Shipping