ROHM Semiconductor BD6383EFV-E2

ROHM Semiconductor BD6383EFV-E2 electronic component product image

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Manufacturer
Manufacturer No
BD6383EFV-E2
Availability
In Stock
Package
40-VSSOP (0.213", 5.40mm Width) Exposed Pad
Packaging
Tape & Reel (TR); Cut Tape (CT)
Description
IC MTR DRV BIPLR 10-28V 40HTSSOP
Detailed Description
Bipolar Motor Driver DMOS Parallel 40-HTSSOP-B
Datasheet
Payment
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Delivery
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AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Series
-
Function
Driver - Fully Integrated, Control and Power Stage
Interface
Parallel
Packaging
Tape & Reel (TR); Cut Tape (CT)
Technology
DMOS
Applications
General Purpose
Manufacturer
Rohm Semiconductor
Mounting Type
Surface Mount
Package / Case
40-VSSOP (0.213", 5.40mm Width) Exposed Pad
Voltage - Load
10V ~ 28V
Step Resolution
1, 1/2, 1/4
Current - Output
700mA
Voltage - Supply
10V ~ 28V
Base Product Number
BD6383
Motor Type - AC, DC
Brushed DC
Motor Type - Stepper
Bipolar
Output Configuration
Half Bridge (4)
Operating Temperature
-25°C ~ 150°C (TJ)
Supplier Device Package
40-HTSSOP-B
AttributeValue
Series-
FunctionDriver - Fully Integrated, Control and Power Stage
InterfaceParallel
PackagingTape & Reel (TR); Cut Tape (CT)
TechnologyDMOS
ApplicationsGeneral Purpose
ManufacturerRohm Semiconductor
Mounting TypeSurface Mount
Package / Case40-VSSOP (0.213", 5.40mm Width) Exposed Pad
Voltage - Load10V ~ 28V
Step Resolution1, 1/2, 1/4
Current - Output700mA
Voltage - Supply10V ~ 28V
Base Product NumberBD6383
Motor Type - AC, DCBrushed DC
Motor Type - StepperBipolar
Output ConfigurationHalf Bridge (4)
Operating Temperature-25°C ~ 150°C (TJ)
Supplier Device Package40-HTSSOP-B

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Packaging Process

Product before packing
Step1: Product
Product in vacuum packaging
Step2: Vacuum Packaging
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Step3: Anti-Static Bag
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