10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

Rochester Electronics, LLC P89LPC922FDH

Rochester Electronics, LLC P89LPC922FDH electronic component product image

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Manufacturer No
P89LPC922FDH
Date Code
15+
Quantity
1,000
Availability
In Stock
Package
20-TSSOP (0.173", 4.40mm Width)
Packaging
Bulk
Description
IC MCU 8BIT
Detailed Description
8051 LPC900 Microcontroller IC 8-Bit 18MHz 8KB (8K x 8) FLASH 20-TSSOP
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Mfr
Rochester Electronics, LLC
Speed
18MHz
Series
LPC900
RAM Size
256 x 8
Core Size
8-Bit
Packaging
Bulk
EEPROM Size
-
Peripherals
Brown-out Detect/Reset, LED, POR, PWM, WDT
Connectivity
I2C, UART/USART
Mounting Type
Surface Mount
Number of I/O
18
Core Processor
8051
Package / Case
20-TSSOP (0.173", 4.40mm Width)
Data Converters
-
Oscillator Type
Internal
Base Product Number
P89LPC922
Program Memory Size
8KB (8K x 8)
Program Memory Type
FLASH
DigiKey Programmable
Not Verified
Operating Temperature
0°C ~ 70°C (TA)
Supplier Device Package
20-TSSOP
Voltage - Supply (Vcc/Vdd)
2.4V ~ 3.6V
AttributeValue
MfrRochester Electronics, LLC
Speed18MHz
SeriesLPC900
RAM Size256 x 8
Core Size8-Bit
PackagingBulk
EEPROM Size-
PeripheralsBrown-out Detect/Reset, LED, POR, PWM, WDT
ConnectivityI2C, UART/USART
Mounting TypeSurface Mount
Number of I/O18
Core Processor8051
Package / Case20-TSSOP (0.173", 4.40mm Width)
Data Converters-
Oscillator TypeInternal
Base Product NumberP89LPC922
Program Memory Size8KB (8K x 8)
Program Memory TypeFLASH
DigiKey ProgrammableNot Verified
Operating Temperature0°C ~ 70°C (TA)
Supplier Device Package20-TSSOP
Voltage - Supply (Vcc/Vdd)2.4V ~ 3.6V

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2. Product availability and pricing may change over time. Our sales manager will verify the details of your order and contact you if any changes or confirmation are required.

Packaging Process