10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

Renesas Electronics Corporation UPC277MP-KAA-E1-A

Renesas Electronics Corporation UPC277MP-KAA-E1-A electronic component product image

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Manufacturer No
UPC277MP-KAA-E1-A
Quantity
118
Availability
In Stock
Package
8-TSSOP (0.110", 2.80mm Width)
Packaging
Tape & Reel (TR); Cut Tape (CT)
Description
UPC277MP-KAA-E1-A
Detailed Description
Comparator Standard (General Purpose) Open-Collector 8-TSSOP
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Type
Standard (General Purpose)
Series
-
Packaging
Tape & Reel (TR); Cut Tape (CT)
Hysteresis
-
Output Type
Open-Collector
Manufacturer
Renesas Electronics Corporation
Mounting Type
Surface Mount
Package / Case
8-TSSOP (0.110", 2.80mm Width)
CMRR, PSRR (Typ)
-
Number of Elements
2
Operating Temperature
-40°C ~ 125°C (TA)
Current - Output (Typ)
16mA
Propagation Delay (Max)
-
Supplier Device Package
8-TSSOP
Current - Quiescent (Max)
1mA
Current - Input Bias (Max)
0.25µA @ 1.4V
Voltage - Input Offset (Max)
5mV @ 1.4V
Voltage - Supply, Single/Dual (±)
2V ~ 32V, ±1V ~ 16V
AttributeValue
TypeStandard (General Purpose)
Series-
PackagingTape & Reel (TR); Cut Tape (CT)
Hysteresis-
Output TypeOpen-Collector
ManufacturerRenesas Electronics Corporation
Mounting TypeSurface Mount
Package / Case8-TSSOP (0.110", 2.80mm Width)
CMRR, PSRR (Typ)-
Number of Elements2
Operating Temperature-40°C ~ 125°C (TA)
Current - Output (Typ)16mA
Propagation Delay (Max)-
Supplier Device Package8-TSSOP
Current - Quiescent (Max)1mA
Current - Input Bias (Max)0.25µA @ 1.4V
Voltage - Input Offset (Max)5mV @ 1.4V
Voltage - Supply, Single/Dual (±)2V ~ 32V, ±1V ~ 16V

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Important Notes

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2. Product availability and pricing may change over time. Our sales manager will verify the details of your order and contact you if any changes or confirmation are required.

Packaging Process