10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

Renesas Electronics Corporation HFA1112IBZ

Renesas Electronics Corporation HFA1112IBZ electronic component product image

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Manufacturer No
HFA1112IBZ
Date Code
21+
Quantity
2,675
Availability
In Stock
Package
8-SOIC (0.154", 3.90mm Width)
Packaging
Tube
Description
IC BUFFER 1 CIRCUIT 8SOIC
Detailed Description
Buffer Amplifier 1 Circuit 8-SOIC
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Mfr
Renesas Electronics Corporation
Series
-
Packaging
Tube
Slew Rate
2400V/µs
Output Type
-
Mounting Type
Surface Mount
-3db Bandwidth
850 MHz
Amplifier Type
Buffer
Package / Case
8-SOIC (0.154", 3.90mm Width)
Current - Supply
21mA
Number of Circuits
1
Base Product Number
HFA1112
Current - Input Bias
25 µA
Operating Temperature
-40°C ~ 85°C
Voltage - Input Offset
8 mV
Supplier Device Package
8-SOIC
Current - Output / Channel
60 mA
Voltage - Supply Span (Max)
11 V
Voltage - Supply Span (Min)
9 V
AttributeValue
MfrRenesas Electronics Corporation
Series-
PackagingTube
Slew Rate2400V/µs
Output Type-
Mounting TypeSurface Mount
-3db Bandwidth850 MHz
Amplifier TypeBuffer
Package / Case8-SOIC (0.154", 3.90mm Width)
Current - Supply21mA
Number of Circuits1
Base Product NumberHFA1112
Current - Input Bias25 µA
Operating Temperature-40°C ~ 85°C
Voltage - Input Offset8 mV
Supplier Device Package8-SOIC
Current - Output / Channel60 mA
Voltage - Supply Span (Max)11 V
Voltage - Supply Span (Min)9 V

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Packaging Process