10-13 NOV 2026 · Munich, Germany

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Renesas Electronics Corporation HD64F3062BFBL25V

Renesas Electronics Corporation HD64F3062BFBL25V electronic component product image

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Manufacturer No
HD64F3062BFBL25V
Date Code
21+
Quantity
2,360
Availability
In Stock
Package
100-BFQFP
Packaging
Tray
Description
IC MCU 16BIT 128KB FLASH 100QFP
Detailed Description
H8/300H H8® H8/300H Microcontroller IC 16-Bit 25MHz 128KB (128K x 8) FLASH 100-QFP (14x14)
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Mfr
Renesas Electronics Corporation
Speed
25MHz
Series
H8® H8/300H
RAM Size
4K x 8
Core Size
16-Bit
Packaging
Tray
EEPROM Size
-
Peripherals
DMA, PWM, WDT
Connectivity
SCI, SmartCard
Mounting Type
Surface Mount
Number of I/O
70
Core Processor
H8/300H
Package / Case
100-BFQFP
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Base Product Number
HD64F3062
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
DigiKey Programmable
Not Verified
Operating Temperature
-20°C ~ 75°C (TA)
Supplier Device Package
100-QFP (14x14)
Voltage - Supply (Vcc/Vdd)
4.5V ~ 5.5V
AttributeValue
MfrRenesas Electronics Corporation
Speed25MHz
SeriesH8® H8/300H
RAM Size4K x 8
Core Size16-Bit
PackagingTray
EEPROM Size-
PeripheralsDMA, PWM, WDT
ConnectivitySCI, SmartCard
Mounting TypeSurface Mount
Number of I/O70
Core ProcessorH8/300H
Package / Case100-BFQFP
Data ConvertersA/D 8x10b; D/A 2x8b
Oscillator TypeInternal
Base Product NumberHD64F3062
Program Memory Size128KB (128K x 8)
Program Memory TypeFLASH
DigiKey ProgrammableNot Verified
Operating Temperature-20°C ~ 75°C (TA)
Supplier Device Package100-QFP (14x14)
Voltage - Supply (Vcc/Vdd)4.5V ~ 5.5V

Purchase & Inquiry

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Important Notes

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2. Product availability and pricing may change over time. Our sales manager will verify the details of your order and contact you if any changes or confirmation are required.

Packaging Process