10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

Renesas Electronics Corporation DF2238BFA13

Renesas Electronics Corporation DF2238BFA13 electronic component product image

Image is only for reference

Manufacturer No
DF2238BFA13
Package
100-BFQFP
Packaging
Bag
Description
IC MCU 16BIT 256KB FLASH 100QFP
Detailed Description
H8S/2000 H8® H8S/2200 Microcontroller IC 16-Bit 13MHz 256KB (256K x 8) FLASH 100-QFP (14x14)
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Mfr
Renesas Electronics Corporation
Speed
13MHz
Series
H8® H8S/2200
RAM Size
16K x 8
Core Size
16-Bit
Packaging
Bag
EEPROM Size
-
Peripherals
POR, PWM, WDT
Connectivity
I2C, SCI, SmartCard
Mounting Type
Surface Mount
Number of I/O
72
Core Processor
H8S/2000
Package / Case
100-BFQFP
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Base Product Number
DF2238
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
DigiKey Programmable
Not Verified
Operating Temperature
-20°C ~ 75°C (TA)
Supplier Device Package
100-QFP (14x14)
Voltage - Supply (Vcc/Vdd)
3V ~ 5.5V
AttributeValue
MfrRenesas Electronics Corporation
Speed13MHz
SeriesH8® H8S/2200
RAM Size16K x 8
Core Size16-Bit
PackagingBag
EEPROM Size-
PeripheralsPOR, PWM, WDT
ConnectivityI2C, SCI, SmartCard
Mounting TypeSurface Mount
Number of I/O72
Core ProcessorH8S/2000
Package / Case100-BFQFP
Data ConvertersA/D 8x10b; D/A 2x8b
Oscillator TypeInternal
Base Product NumberDF2238
Program Memory Size256KB (256K x 8)
Program Memory TypeFLASH
DigiKey ProgrammableNot Verified
Operating Temperature-20°C ~ 75°C (TA)
Supplier Device Package100-QFP (14x14)
Voltage - Supply (Vcc/Vdd)3V ~ 5.5V

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Important Notes

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2. Product availability and pricing may change over time. Our sales manager will verify the details of your order and contact you if any changes or confirmation are required.

Packaging Process