QuickLogic EOS3FLF512-WRN42

QuickLogic EOS3FLF512-WRN42 electronic component product image

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Manufacturer
Manufacturer No
EOS3FLF512-WRN42
Availability
In Stock
Package
42-WLCSP
Packaging
Tape & Reel (TR)
Description
EOS S3 ULTRA LOW POWER SENSOR &
Detailed Description
Field Programmable 32-Bit ARM M4F 2k Gates 42-CSP (2.65mm x 2.42mm)
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Speed
80 MHz
Series
EOS S3
Core Type
32-Bit ARM M4F
FPGA SRAM
64kb
Interface
I2C, UART, SPI, PDM, I2S, 12-bit ADC
Packaging
Tape & Reel (TR)
FPGA Gates
2k
EEPROM Size
-
Manufacturer
QuickLogic
Mounting Type
Surface Mount
FPGA Registers
891
Package / Case
42-WLCSP
Data SRAM Bytes
512K
FPGA Core Cells
891
Voltage - Supply
1.1V
Program SRAM Bytes
512K
Operating Temperature
-20°C ~ 85°C (TJ)
Supplier Device Package
42-CSP (2.65mm x 2.42mm)
AttributeValue
Speed80 MHz
SeriesEOS S3
Core Type32-Bit ARM M4F
FPGA SRAM64kb
InterfaceI2C, UART, SPI, PDM, I2S, 12-bit ADC
PackagingTape & Reel (TR)
FPGA Gates2k
EEPROM Size-
ManufacturerQuickLogic
Mounting TypeSurface Mount
FPGA Registers891
Package / Case42-WLCSP
Data SRAM Bytes512K
FPGA Core Cells891
Voltage - Supply1.1V
Program SRAM Bytes512K
Operating Temperature-20°C ~ 85°C (TJ)
Supplier Device Package42-CSP (2.65mm x 2.42mm)

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Packaging Process

Product before packing
Step1: Product
Product in vacuum packaging
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-Static Bag
Individual packaging box
Step4: Package Boxes
Packaging box with shipping label
Step5: Bar-Code Shipping Tags
Shipping by cargo vessel
Step6: Shipping