10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

Quest Semi QSD12HCS65U

Quest Semi QSD12HCS65U electronic component product image

Image is only for reference

Manufacturer
Manufacturer No
QSD12HCS65U
Package
TO-247-3
Packaging
Tube
Description
SiC Homogeneous Schottky Barrier
Detailed Description
Diode 650 V Through Hole TO-247-3L
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Mfr
Quest Semi
Grade
-
Speed
Zero Recovery Time > 500mA (Io)
Series
-
Packaging
Tube
Technology
SiC (Silicon Carbide) Schottky
Mounting Type
Through Hole
Qualification
-
Package / Case
TO-247-3
Supplier Device Package
TO-247-3L
Reverse Recovery Time (trr)
0 ns
Current - Reverse Leakage @ Vr
30 µA @ 650 V
Voltage - DC Reverse (Vr) (Max)
650 V
Operating Temperature - Junction
-55°C ~ 175°C
Voltage - Forward (Vf) (Max) @ If
1.6 V @ 12 A
AttributeValue
MfrQuest Semi
Grade-
SpeedZero Recovery Time > 500mA (Io)
Series-
PackagingTube
TechnologySiC (Silicon Carbide) Schottky
Mounting TypeThrough Hole
Qualification-
Package / CaseTO-247-3
Supplier Device PackageTO-247-3L
Reverse Recovery Time (trr)0 ns
Current - Reverse Leakage @ Vr30 µA @ 650 V
Voltage - DC Reverse (Vr) (Max)650 V
Operating Temperature - Junction-55°C ~ 175°C
Voltage - Forward (Vf) (Max) @ If1.6 V @ 12 A

Purchase & Inquiry

Placing an Order

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Payment Options

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RFQ (Request for Quote)

We suggest submitting an RFQ to get the most up-to-date pricing and availability for the components you are looking for. Our sales team will reply by email within 24 hours.

Important Notes

1. An email containing your order details will be sent to your inbox. If you cannot find it, please check your spam or junk mail folder.

2. Product availability and pricing may change over time. Our sales manager will verify the details of your order and contact you if any changes or confirmation are required.

Packaging Process