10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

onsemi SS1003EJ-TR

onsemi SS1003EJ-TR electronic component product image

Image is only for reference

Manufacturer
Manufacturer No
SS1003EJ-TR
Package
4-UFDFN
Packaging
Bulk
Description
DIODE ARRAY SCHOTT 30V 1A 4ECSP
Detailed Description
Diode Array 2 Independent 30 V 1A Surface Mount 4-UFDFN
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Speed
Fast Recovery =< 500ns, > 200mA (Io)
Series
-
Packaging
Bulk
Technology
Schottky
Manufacturer
onsemi
Mounting Type
Surface Mount
Package / Case
4-UFDFN
Base Product Number
SS1003
Diode Configuration
2 Independent
Supplier Device Package
4-ECSP1608
Reverse Recovery Time (trr)
10 ns
Current - Reverse Leakage @ Vr
360 µA @ 15 V
Voltage - DC Reverse (Vr) (Max)
30 V
Operating Temperature - Junction
-55°C ~ 125°C
Voltage - Forward (Vf) (Max) @ If
450 mV @ 1 A
Current - Average Rectified (Io) (per Diode)
1A
AttributeValue
SpeedFast Recovery =< 500ns, > 200mA (Io)
Series-
PackagingBulk
TechnologySchottky
Manufactureronsemi
Mounting TypeSurface Mount
Package / Case4-UFDFN
Base Product NumberSS1003
Diode Configuration2 Independent
Supplier Device Package4-ECSP1608
Reverse Recovery Time (trr)10 ns
Current - Reverse Leakage @ Vr360 µA @ 15 V
Voltage - DC Reverse (Vr) (Max)30 V
Operating Temperature - Junction-55°C ~ 125°C
Voltage - Forward (Vf) (Max) @ If450 mV @ 1 A
Current - Average Rectified (Io) (per Diode)1A

Purchase & Inquiry

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Important Notes

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2. Product availability and pricing may change over time. Our sales manager will verify the details of your order and contact you if any changes or confirmation are required.

Packaging Process