10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

onsemi NTC020N120SC1

onsemi NTC020N120SC1 electronic component product image

Image is only for reference

Manufacturer
Manufacturer No
NTC020N120SC1
Package
Die
Packaging
Tray
Description
SIC MOS WAFER SALES 20MOHM 1200V
Detailed Description
N-Channel 1200 V 103A (Tc) 535W (Tc) Surface Mount Die
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Mfr
onsemi
Grade
-
Series
-
FET Type
N-Channel
Packaging
Tray
Vgs (Max)
+25V, -15V
Technology
SiCFET (Silicon Carbide)
FET Feature
-
Mounting Type
Surface Mount
Qualification
-
Package / Case
Die
Vgs(th) (Max) @ Id
4.3V @ 20mA
Operating Temperature
-55°C ~ 175°C (TJ)
Rds On (Max) @ Id, Vgs
28mOhm @ 60A, 20V
Power Dissipation (Max)
535W (Tc)
Supplier Device Package
Die
Gate Charge (Qg) (Max) @ Vgs
203 nC @ 20 V
Drain to Source Voltage (Vdss)
1200 V
Input Capacitance (Ciss) (Max) @ Vds
2890 pF @ 800 V
Drive Voltage (Max Rds On, Min Rds On)
20V
Current - Continuous Drain (Id) @ 25°C
103A (Tc)
AttributeValue
Mfronsemi
Grade-
Series-
FET TypeN-Channel
PackagingTray
Vgs (Max)+25V, -15V
TechnologySiCFET (Silicon Carbide)
FET Feature-
Mounting TypeSurface Mount
Qualification-
Package / CaseDie
Vgs(th) (Max) @ Id4.3V @ 20mA
Operating Temperature-55°C ~ 175°C (TJ)
Rds On (Max) @ Id, Vgs28mOhm @ 60A, 20V
Power Dissipation (Max)535W (Tc)
Supplier Device PackageDie
Gate Charge (Qg) (Max) @ Vgs203 nC @ 20 V
Drain to Source Voltage (Vdss)1200 V
Input Capacitance (Ciss) (Max) @ Vds2890 pF @ 800 V
Drive Voltage (Max Rds On, Min Rds On)20V
Current - Continuous Drain (Id) @ 25°C103A (Tc)

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Packaging Process