10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

onsemi MOCD207R2M

onsemi MOCD207R2M electronic component product image

Image is only for reference

Manufacturer
Manufacturer No
MOCD207R2M
Date Code
24+
Quantity
2,500
Availability
In Stock
Package
SOIC
Packaging
Tape and Reel
Description
Optocoupler DC-IN 2-CH Transistor DC-OUT 8-Pin SOIC T/R
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
HTS
COMPONENTS
PPAP
No
EU RoHS
Compliant
Mounting
Surface Mount
ECCN (US)
EAR99
Packaging
Tape and Reel
Pin Count
8
Standards
UL
Automotive
No
Input Type
DC
Lead Shape
Gull-wing
Output Type
DC
PCB changed
8
Availability
In Stock (cut strips)
Output Device
Transistor
Package Width
3.91
Package Height
3.43(Max)
Package Length
4.88
Supplier Package
SOIC
Standard Package Name
SO
Typical Fall Time (us)
4.7
Typical Rise Time (us)
3.2
Maximum Forward Voltage (V)
1.55
Maximum Reverse Voltage (V)
6
Number of Channels per Chip
2
Typical Forward Voltage (V)
1.25
Maximum Forward Current (mA)
60
Maximum Collector Current (mA)
150
Maximum Power Dissipation (mW)
250
Minimum Isolation Voltage (Vrms)
2500
Maximum Current Transfer Ratio (%)
200
Minimum Current Transfer Ratio (%)
100
Maximum Operating Temperature (°C)
100
Minimum Operating Temperature (°C)
-40
Maximum Collector-Emitter Voltage (V)
70
Current Transfer Ratio Test Current (mA)
10
Maximum Collector-Emitter Saturation Voltage (mV)
400
AttributeValue
HTSCOMPONENTS
PPAPNo
EU RoHSCompliant
MountingSurface Mount
ECCN (US)EAR99
PackagingTape and Reel
Pin Count8
StandardsUL
AutomotiveNo
Input TypeDC
Lead ShapeGull-wing
Output TypeDC
PCB changed8
AvailabilityIn Stock (cut strips)
Output DeviceTransistor
Package Width3.91
Package Height3.43(Max)
Package Length4.88
Supplier PackageSOIC
Standard Package NameSO
Typical Fall Time (us)4.7
Typical Rise Time (us)3.2
Maximum Forward Voltage (V)1.55
Maximum Reverse Voltage (V)6
Number of Channels per Chip2
Typical Forward Voltage (V)1.25
Maximum Forward Current (mA)60
Maximum Collector Current (mA)150
Maximum Power Dissipation (mW)250
Minimum Isolation Voltage (Vrms)2500
Maximum Current Transfer Ratio (%)200
Minimum Current Transfer Ratio (%)100
Maximum Operating Temperature (°C)100
Minimum Operating Temperature (°C)-40
Maximum Collector-Emitter Voltage (V)70
Current Transfer Ratio Test Current (mA)10
Maximum Collector-Emitter Saturation Voltage (mV)400

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Packaging Process