onsemi MMBF5484
HTS
COMPONENTS
PPAP
No
Type
JFET
EU RoHS
Compliant
Mounting
Surface Mount
ECCN (US)
EAR99
Packaging
Tape and Reel
Pin Count
3
Automotive
No
Lead Shape
Gull-wing
PCB changed
3
Availability
No Stock Available
Channel Type
N
Configuration
Single
Package Width
1.3
Package Height
0.94
Package Length
2.9
Supplier Package
SOT-23
Maximum IDSS (uA)
5000
Standard Package Name
SOT
Manufacturer Lead Time
13 weeks
Number of Elements per Chip
1
Maximum Power Dissipation (mW)
225
Maximum Gate-Source Voltage (V)
-25
Maximum Operating Temperature (°C)
150
Minimum Operating Temperature (°C)
-55
Typical Forward Transconductance (S)
0.006(Max)
Typical Input Capacitance @ Vds (pF)
5(Max)@15V
Typical Output Capacitance @ Vds (pF)
2(Max)@15V
Maximum Gate-Source Leakage Current (nA)
1
Typical Reverse Transfer Capacitance @ Vds (pF)
1(Max)@15V
| Attribute | Value |
|---|---|
| HTS | COMPONENTS |
| PPAP | No |
| Type | JFET |
| EU RoHS | Compliant |
| Mounting | Surface Mount |
| ECCN (US) | EAR99 |
| Packaging | Tape and Reel |
| Pin Count | 3 |
| Automotive | No |
| Lead Shape | Gull-wing |
| PCB changed | 3 |
| Availability | No Stock Available |
| Channel Type | N |
| Configuration | Single |
| Package Width | 1.3 |
| Package Height | 0.94 |
| Package Length | 2.9 |
| Supplier Package | SOT-23 |
| Maximum IDSS (uA) | 5000 |
| Standard Package Name | SOT |
| Manufacturer Lead Time | 13 weeks |
| Number of Elements per Chip | 1 |
| Maximum Power Dissipation (mW) | 225 |
| Maximum Gate-Source Voltage (V) | -25 |
| Maximum Operating Temperature (°C) | 150 |
| Minimum Operating Temperature (°C) | -55 |
| Typical Forward Transconductance (S) | 0.006(Max) |
| Typical Input Capacitance @ Vds (pF) | 5(Max)@15V |
| Typical Output Capacitance @ Vds (pF) | 2(Max)@15V |
| Maximum Gate-Source Leakage Current (nA) | 1 |
| Typical Reverse Transfer Capacitance @ Vds (pF) | 1(Max)@15V |
Purchase & Inquiry
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Packaging Process
