10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

onsemi MC74LCX541DTR2G

onsemi MC74LCX541DTR2G electronic component product image

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Manufacturer
Manufacturer No
MC74LCX541DTR2G
Date Code
21+
Quantity
48,000
Availability
In Stock
Package
20-TSSOP (0.173", 4.40mm Width)
Packaging
Tape & Reel (TR); Cut Tape (CT)
Description
IC BUFF 2V/3.6V 20-TSSOP
Detailed Description
Buffer, Non-Inverting 1 Element 8 Bit per Element 3-State Output 20-TSSOP
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Series
74LCX
Packaging
Tape & Reel (TR); Cut Tape (CT)
Input Type
-
Logic Type
Buffer, Non-Inverting
Output Type
3-State
Manufacturer
onsemi
Mounting Type
Surface Mount
Package / Case
20-TSSOP (0.173", 4.40mm Width)
Voltage - Supply
2V ~ 3.6V
Number of Elements
1
Base Product Number
74LCX541
Operating Temperature
-40°C ~ 85°C (TA)
Supplier Device Package
20-TSSOP
Current - Output High, Low
24mA, 24mA
Number of Bits per Element
8
AttributeValue
Series74LCX
PackagingTape & Reel (TR); Cut Tape (CT)
Input Type-
Logic TypeBuffer, Non-Inverting
Output Type3-State
Manufactureronsemi
Mounting TypeSurface Mount
Package / Case20-TSSOP (0.173", 4.40mm Width)
Voltage - Supply2V ~ 3.6V
Number of Elements1
Base Product Number74LCX541
Operating Temperature-40°C ~ 85°C (TA)
Supplier Device Package20-TSSOP
Current - Output High, Low24mA, 24mA
Number of Bits per Element8

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Packaging Process