onsemi HCPL2530SDM
Image is only for reference
| Attribute | Value |
|---|---|
| HTS | 8541.49.80.00 |
| PPAP | No |
| EU RoHS | Compliant |
| Mounting | Surface Mount |
| ECCN (US) | EAR99 |
| Packaging | Tape and Reel |
| Pin Count | 8 |
| Automotive | No |
| Input Type | DC |
| Lead Shape | Gull-wing |
| Output Type | DC |
| PCB changed | 8 |
| Availability | No Stock Available |
| Output Device | Transistor |
| Package Width | 6.86(Max) |
| Package Height | 3.94(Max) |
| Package Length | 9.91(Max) |
| Supplier Package | PDIP SMD |
| Standard Package Name | DIP |
| Manufacturer Lead Time | 30 weeks |
| Maximum Forward Voltage (V) | 1.7 |
| Number of Channels per Chip | 2 |
| Typical Forward Voltage (V) | 1.45 |
| Maximum Power Dissipation (mW) | 100 |
| Minimum Isolation Voltage (Vrms) | 5000 |
| Maximum Current Transfer Ratio (%) | 50 |
| Minimum Current Transfer Ratio (%) | 7 |
| Maximum Operating Temperature (°C) | 100 |
| Minimum Operating Temperature (°C) | -40 |
| Current Transfer Ratio Test Current (mA) | 16 |
Purchase & Inquiry
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2. Product availability and pricing may change over time. Our sales manager will verify the details of your order and contact you if any changes or confirmation are required.
Packaging Process
