10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

onsemi FOD817BSD

onsemi FOD817BSD electronic component product image

Image is only for reference

Manufacturer
Manufacturer No
FOD817BSD
Date Code
26+
Quantity
5,000
Availability
In Stock
Package
PDIP SMD
Packaging
Tape and Reel
Description
Optocoupler DC-IN 1-CH Transistor DC-OUT 4-Pin PDIP SMD T/R
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
HTS
COMPONENTS
PPAP
No
EU RoHS
Compliant
Mounting
Surface Mount
ECCN (US)
EAR99
Packaging
Tape and Reel
Pin Count
4
Standards
DIN|UL
Automotive
No
Input Type
DC
Lead Shape
Gull-wing
Output Type
DC
PCB changed
4
Availability
In Stock (cut strips)
Output Device
Transistor
Package Width
6.5
Package Height
3.5
Package Length
4.6
Supplier Package
PDIP SMD
Standard Package Name
DIP
Manufacturer Lead Time
15 weeks
Maximum Fall Time (us)
18
Maximum Rise Time (us)
18
Typical Fall Time (us)
3
Typical Rise Time (us)
4
Maximum Forward Voltage (V)
1.4
Maximum Reverse Voltage (V)
6
Number of Channels per Chip
1
Typical Forward Voltage (V)
1.2
Maximum Forward Current (mA)
50
Maximum Collector Current (mA)
50
Maximum Power Dissipation (mW)
200
Minimum Isolation Voltage (Vrms)
5000
Maximum Current Transfer Ratio (%)
260
Minimum Current Transfer Ratio (%)
130
Maximum Operating Temperature (°C)
110
Minimum Operating Temperature (°C)
-55
Maximum Collector-Emitter Voltage (V)
70
Current Transfer Ratio Test Current (mA)
5
Maximum Collector-Emitter Saturation Voltage (mV)
200
AttributeValue
HTSCOMPONENTS
PPAPNo
EU RoHSCompliant
MountingSurface Mount
ECCN (US)EAR99
PackagingTape and Reel
Pin Count4
StandardsDIN|UL
AutomotiveNo
Input TypeDC
Lead ShapeGull-wing
Output TypeDC
PCB changed4
AvailabilityIn Stock (cut strips)
Output DeviceTransistor
Package Width6.5
Package Height3.5
Package Length4.6
Supplier PackagePDIP SMD
Standard Package NameDIP
Manufacturer Lead Time15 weeks
Maximum Fall Time (us)18
Maximum Rise Time (us)18
Typical Fall Time (us)3
Typical Rise Time (us)4
Maximum Forward Voltage (V)1.4
Maximum Reverse Voltage (V)6
Number of Channels per Chip1
Typical Forward Voltage (V)1.2
Maximum Forward Current (mA)50
Maximum Collector Current (mA)50
Maximum Power Dissipation (mW)200
Minimum Isolation Voltage (Vrms)5000
Maximum Current Transfer Ratio (%)260
Minimum Current Transfer Ratio (%)130
Maximum Operating Temperature (°C)110
Minimum Operating Temperature (°C)-55
Maximum Collector-Emitter Voltage (V)70
Current Transfer Ratio Test Current (mA)5
Maximum Collector-Emitter Saturation Voltage (mV)200

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