10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

onsemi FOD3182S

onsemi FOD3182S electronic component product image

Image is only for reference

Manufacturer
Manufacturer No
FOD3182S
Date Code
23+
Quantity
2,000
Availability
In Stock
Package
PDIP SMD
Packaging
Bag
Description
Optocoupler Drive Push-Pull 1-CH 2000V 8-Pin PDIP SMD Bag
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
HTS
8541.49.80.00
PPAP
No
EU RoHS
Compliant
Mounting
Surface Mount
ECCN (US)
EAR99
Packaging
Bag
Pin Count
8
Automotive
No
Lead Shape
Gull-wing
Output Type
Push-Pull
PCB changed
8
Availability
In Stock
Package Width
6.86(Max)
Package Height
3.94(Max)
Package Length
9.91(Max)
Supplier Package
PDIP SMD
Standard Package Name
DIP
Manufacturer Lead Time
16 weeks
Maximum Fall Time (ns)
24(Typ)
Maximum Rise Time (ns)
38(Typ)
Common Mode Voltage (V)
2000
Maximum Forward Voltage (V)
1.8
Maximum Reverse Voltage (V)
5
Minimum Forward Voltage (V)
1.1
Number of Channels per Chip
1
Maximum Forward Current (mA)
25
Maximum Power Dissipation (mW)
295
Maximum Peak Output Current (A)
3
Minimum Isolation Voltage (Vrms)
5000
Maximum Operating Temperature (°C)
100
Maximum Pulse Width Distortion (ns)
65
Minimum Operating Temperature (°C)
-40
Minimum Common Mode Rejection (kV/us)
35
Maximum Working Insulation Voltage (Vp)
1414
Maximum Propagation Delay Time (tPHL) (ns)
210
Maximum Propagation Delay Time (tPLH) (ns)
210
AttributeValue
HTS8541.49.80.00
PPAPNo
EU RoHSCompliant
MountingSurface Mount
ECCN (US)EAR99
PackagingBag
Pin Count8
AutomotiveNo
Lead ShapeGull-wing
Output TypePush-Pull
PCB changed8
AvailabilityIn Stock
Package Width6.86(Max)
Package Height3.94(Max)
Package Length9.91(Max)
Supplier PackagePDIP SMD
Standard Package NameDIP
Manufacturer Lead Time16 weeks
Maximum Fall Time (ns)24(Typ)
Maximum Rise Time (ns)38(Typ)
Common Mode Voltage (V)2000
Maximum Forward Voltage (V)1.8
Maximum Reverse Voltage (V)5
Minimum Forward Voltage (V)1.1
Number of Channels per Chip1
Maximum Forward Current (mA)25
Maximum Power Dissipation (mW)295
Maximum Peak Output Current (A)3
Minimum Isolation Voltage (Vrms)5000
Maximum Operating Temperature (°C)100
Maximum Pulse Width Distortion (ns)65
Minimum Operating Temperature (°C)-40
Minimum Common Mode Rejection (kV/us)35
Maximum Working Insulation Voltage (Vp)1414
Maximum Propagation Delay Time (tPHL) (ns)210
Maximum Propagation Delay Time (tPLH) (ns)210

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Packaging Process