10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

onsemi FDMC007N30D

onsemi FDMC007N30D electronic component product image

Image is only for reference

Manufacturer
Manufacturer No
FDMC007N30D
Quantity
2,100
Availability
In Stock
Package
8-PowerWDFN
Packaging
Tape & Reel (TR); Cut Tape (CT)
Description
MOSFET 2N-CH 30V 46A 8PWR33
Detailed Description
Mosfet Array 30V 46A 1.9W, 2.5W Surface Mount 8-Power33 (3x3)
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Series
-
Packaging
Tape & Reel (TR); Cut Tape (CT)
Technology
MOSFET (Metal Oxide)
FET Feature
-
Power - Max
1.9W, 2.5W
Manufacturer
onsemi
Configuration
2 N-Channel (Dual)
Mounting Type
Surface Mount
Package / Case
8-PowerWDFN
Vgs(th) (Max) @ Id
3V @ 250µA
Base Product Number
FDMC007
Operating Temperature
-55°C ~ 150°C (TJ)
Rds On (Max) @ Id, Vgs
11.6mOhm @ 10A, 10V
Supplier Device Package
8-Power33 (3x3)
Gate Charge (Qg) (Max) @ Vgs
34nC @ 10V
Drain to Source Voltage (Vdss)
30V
Input Capacitance (Ciss) (Max) @ Vds
1110pF @ 15V, 2360pF @ 15V
Current - Continuous Drain (Id) @ 25°C
46A
AttributeValue
Series-
PackagingTape & Reel (TR); Cut Tape (CT)
TechnologyMOSFET (Metal Oxide)
FET Feature-
Power - Max1.9W, 2.5W
Manufactureronsemi
Configuration2 N-Channel (Dual)
Mounting TypeSurface Mount
Package / Case8-PowerWDFN
Vgs(th) (Max) @ Id3V @ 250µA
Base Product NumberFDMC007
Operating Temperature-55°C ~ 150°C (TJ)
Rds On (Max) @ Id, Vgs11.6mOhm @ 10A, 10V
Supplier Device Package8-Power33 (3x3)
Gate Charge (Qg) (Max) @ Vgs34nC @ 10V
Drain to Source Voltage (Vdss)30V
Input Capacitance (Ciss) (Max) @ Vds1110pF @ 15V, 2360pF @ 15V
Current - Continuous Drain (Id) @ 25°C46A

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