10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

onsemi AP0201AT2L00XEGA0-DR

onsemi AP0201AT2L00XEGA0-DR electronic component product image

Image is only for reference

Manufacturer
Manufacturer No
AP0201AT2L00XEGA0-DR
Date Code
16+
Quantity
2,597
Availability
In Stock
Package
VFBGA
Packaging
Tray
Description
Image Sensor CMOS Automotive AEC-Q100 100-Pin VFBGA Tray
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
HTS
8541.40.95.00
PPAP
Yes
Type
CMOS
EU RoHS
Compliant
Mounting
Surface Mount
ECCN (US)
EAR99
Packaging
Tray
Pin Count
100
Automotive
Yes
Lead Shape
Ball
PCB changed
100
Availability
No Stock Available
Package Width
7
Package Height
0.7
Package Length
7
Supplier Package
VFBGA
Standard Package Name
BGA
Module/IC Classification
IC
Supplier Temperature Grade
Automotive
AttributeValue
HTS8541.40.95.00
PPAPYes
TypeCMOS
EU RoHSCompliant
MountingSurface Mount
ECCN (US)EAR99
PackagingTray
Pin Count100
AutomotiveYes
Lead ShapeBall
PCB changed100
AvailabilityNo Stock Available
Package Width7
Package Height0.7
Package Length7
Supplier PackageVFBGA
Standard Package NameBGA
Module/IC ClassificationIC
Supplier Temperature GradeAutomotive

Purchase & Inquiry

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RFQ (Request for Quote)

We suggest submitting an RFQ to get the most up-to-date pricing and availability for the components you are looking for. Our sales team will reply by email within 24 hours.

Important Notes

1. An email containing your order details will be sent to your inbox. If you cannot find it, please check your spam or junk mail folder.

2. Product availability and pricing may change over time. Our sales manager will verify the details of your order and contact you if any changes or confirmation are required.

Packaging Process