onsemi 74LCX14MX
HTS
COMPONENTS
PPAP
No
EU RoHS
Compliant
Mounting
Surface Mount
ECCN (US)
EAR99
Packaging
Tape and Reel
Pin Count
14
Automotive
No
Lead Shape
Gull-wing
PCB changed
14
Availability
No Stock Available
Logic Family
LCX
Package Width
4(Max)
Logic Function
Inverter Schmitt Trigger
Package Height
1.5(Max)
Package Length
8.75(Max)
Supplier Package
SOIC N
Process Technology
0.35um
Standard Package Name
SO
Number of Elements per Chip
6
Maximum Quiescent Current (uA)
10
Maximum Operating Temperature (°C)
85
Minimum Operating Temperature (°C)
-40
Absolute Propagation Delay Time (ns)
7.8
Maximum Operating Supply Voltage (V)
3.6
Minimum Operating Supply Voltage (V)
2
Typical Operating Supply Voltage (V)
2.5|3.3
Maximum Low Level Output Current (mA)
24
Propagation Delay Test Condition (pF)
50
Maximum High Level Output Current (mA)
-24
Maximum Propagation Delay Time @ Maximum CL (ns)
| Attribute | Value |
|---|---|
| HTS | COMPONENTS |
| PPAP | No |
| EU RoHS | Compliant |
| Mounting | Surface Mount |
| ECCN (US) | EAR99 |
| Packaging | Tape and Reel |
| Pin Count | 14 |
| Automotive | No |
| Lead Shape | Gull-wing |
| PCB changed | 14 |
| Availability | No Stock Available |
| Logic Family | LCX |
| Package Width | 4(Max) |
| Logic Function | Inverter Schmitt Trigger |
| Package Height | 1.5(Max) |
| Package Length | 8.75(Max) |
| Supplier Package | SOIC N |
| Process Technology | 0.35um |
| Standard Package Name | SO |
| Number of Elements per Chip | 6 |
| Maximum Quiescent Current (uA) | 10 |
| Maximum Operating Temperature (°C) | 85 |
| Minimum Operating Temperature (°C) | -40 |
| Absolute Propagation Delay Time (ns) | 7.8 |
| Maximum Operating Supply Voltage (V) | 3.6 |
| Minimum Operating Supply Voltage (V) | 2 |
| Typical Operating Supply Voltage (V) | 2.5|3.3 |
| Maximum Low Level Output Current (mA) | 24 |
| Propagation Delay Test Condition (pF) | 50 |
| Maximum High Level Output Current (mA) | -24 |
| Maximum Propagation Delay Time @ Maximum CL (ns) | [email protected]|[email protected]|[email protected] |
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Packaging Process
