onsemi 74FST3257DR2G
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| Attribute | Value |
|---|---|
| HTS | COMPONENTS |
| PPAP | No |
| EU RoHS | Compliant |
| Mounting | Surface Mount |
| ECCN (US) | EAR99 |
| Packaging | Tape and Reel |
| Pin Count | 16 |
| Automotive | No |
| Lead Shape | Gull-wing |
| PCB changed | 16 |
| Availability | In Stock |
| Logic Family | FST |
| Configuration | 4 x 2:1 |
| Package Width | 3.9 |
| Logic Function | Multiplexer/Demultiplexer Bus Switch |
| Package Height | 1.37 |
| Package Length | 9.9 |
| Supplier Package | SOIC |
| Process Technology | CMOS |
| Standard Package Name | SO |
| Number of Inputs per Chip | 8 |
| Number of Outputs per Chip | 4 |
| Maximum On Resistance (Ohm) | 11(Typ) |
| Number of Elements per Chip | 1 |
| Maximum Quiescent Current (uA) | 3 |
| Maximum Operating Temperature (°C) | 85 |
| Minimum Operating Temperature (°C) | -40 |
| Absolute Propagation Delay Time (ns) | 5.7 |
| Maximum Operating Supply Voltage (V) | 5.5 |
| Minimum Operating Supply Voltage (V) | 4 |
| Typical Operating Supply Voltage (V) | 5 |
| Maximum Low Level Output Current (mA) | 128 |
| Propagation Delay Test Condition (pF) | 50 |
| Maximum Propagation Delay Time @ Maximum CL (ns) | [email protected] to 5.5V |
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Packaging Process
