10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

Ohmite FPA100 68R J

Ohmite FPA100 68R J electronic component product image

Image is only for reference

Manufacturer
Manufacturer No
FPA100 68R J
Availability
In Stock
Package
SOT-227-2
Packaging
Tray
Description
100 WATTS THICK FILM 68 OHMS 5%
Detailed Description
68 Ohms ±5% 100W Thick Film Chassis Mount Resistor
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Mfr
Ohmite
Series
FPA100
Features
Non-Inductive
Packaging
Tray
Tolerance
±5%
Lead Style
M4 Threaded
Resistance
68 Ohms
Composition
Thick Film
Failure Rate
-
Power (Watts)
100W
Package / Case
SOT-227-2
Mounting Feature
Screw Holes
Size / Dimension
1.516" L x 1.000" W (38.50mm x 25.40mm)
Coating, Housing Type
-
Height - Seated (Max)
0.492" (12.50mm)
Operating Temperature
-55°C ~ 155°C
Temperature Coefficient
±100ppm/°C
AttributeValue
MfrOhmite
SeriesFPA100
FeaturesNon-Inductive
PackagingTray
Tolerance±5%
Lead StyleM4 Threaded
Resistance68 Ohms
CompositionThick Film
Failure Rate-
Power (Watts)100W
Package / CaseSOT-227-2
Mounting FeatureScrew Holes
Size / Dimension1.516" L x 1.000" W (38.50mm x 25.40mm)
Coating, Housing Type-
Height - Seated (Max)0.492" (12.50mm)
Operating Temperature-55°C ~ 155°C
Temperature Coefficient±100ppm/°C

Purchase & Inquiry

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RFQ (Request for Quote)

We suggest submitting an RFQ to get the most up-to-date pricing and availability for the components you are looking for. Our sales team will reply by email within 24 hours.

Important Notes

1. An email containing your order details will be sent to your inbox. If you cannot find it, please check your spam or junk mail folder.

2. Product availability and pricing may change over time. Our sales manager will verify the details of your order and contact you if any changes or confirmation are required.

Packaging Process