NXP USA Inc. S9S08SG4E2MTJ

NXP USA Inc. S9S08SG4E2MTJ electronic component product image

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Manufacturer
Manufacturer No
S9S08SG4E2MTJ
Quantity
47
Availability
In Stock
Package
20-TSSOP (0.173", 4.40mm Width)
Packaging
Tube
Description
IC MCU 8BIT 4KB FLASH 20TSSOP
Detailed Description
S08 S08 Microcontroller IC 8-Bit 40MHz 4KB (4K x 8) FLASH 20-TSSOP
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Mfr
NXP USA Inc.
Speed
40MHz
Series
S08
RAM Size
256 x 8
Core Size
8-Bit
Packaging
Tube
EEPROM Size
-
Peripherals
LVD, POR, PWM, WDT
Connectivity
I2C, LINbus, SCI, SPI
Mounting Type
Surface Mount
Number of I/O
16
Core Processor
S08
Package / Case
20-TSSOP (0.173", 4.40mm Width)
Data Converters
A/D 12x10b
Oscillator Type
Internal
Base Product Number
S9S08
Program Memory Size
4KB (4K x 8)
Program Memory Type
FLASH
DigiKey Programmable
Not Verified
Operating Temperature
-40°C ~ 125°C (TA)
Supplier Device Package
20-TSSOP
Voltage - Supply (Vcc/Vdd)
2.7V ~ 5.5V
AttributeValue
MfrNXP USA Inc.
Speed40MHz
SeriesS08
RAM Size256 x 8
Core Size8-Bit
PackagingTube
EEPROM Size-
PeripheralsLVD, POR, PWM, WDT
ConnectivityI2C, LINbus, SCI, SPI
Mounting TypeSurface Mount
Number of I/O16
Core ProcessorS08
Package / Case20-TSSOP (0.173", 4.40mm Width)
Data ConvertersA/D 12x10b
Oscillator TypeInternal
Base Product NumberS9S08
Program Memory Size4KB (4K x 8)
Program Memory TypeFLASH
DigiKey ProgrammableNot Verified
Operating Temperature-40°C ~ 125°C (TA)
Supplier Device Package20-TSSOP
Voltage - Supply (Vcc/Vdd)2.7V ~ 5.5V

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Packaging Process

Product before packing
Step1: Product
Product in vacuum packaging
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-Static Bag
Individual packaging box
Step4: Package Boxes
Packaging box with shipping label
Step5: Bar-Code Shipping Tags
Shipping by cargo vessel
Step6: Shipping