10-13 NOV 2026 · Munich, Germany

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NXP USA Inc. MPXC2012DT1

NXP USA Inc. MPXC2012DT1 electronic component product image

Image is only for reference

Manufacturer
Manufacturer No
MPXC2012DT1
Package
4-SSIP Module
Packaging
Tape & Reel (TR)
Description
SENSOR PRESSURE MEDICAL CHIP PAK
Detailed Description
Pressure Sensor 4-SSIP Module
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Series
MPXC2012
Packaging
Tape & Reel (TR)
Manufacturer
NXP USA Inc.
Mounting Type
Through Hole
Package / Case
4-SSIP Module
Termination Style
PCB
Base Product Number
MPXC20
Supplier Device Package
-
AttributeValue
SeriesMPXC2012
PackagingTape & Reel (TR)
ManufacturerNXP USA Inc.
Mounting TypeThrough Hole
Package / Case4-SSIP Module
Termination StylePCB
Base Product NumberMPXC20
Supplier Device Package-

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Important Notes

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2. Product availability and pricing may change over time. Our sales manager will verify the details of your order and contact you if any changes or confirmation are required.

Packaging Process