NXP USA Inc. MPF7100BMBA0ES

NXP USA Inc. MPF7100BMBA0ES electronic component product image

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Manufacturer
Manufacturer No
MPF7100BMBA0ES
Quantity
41
Availability
In Stock
Package
48-VFQFN Exposed Pad
Packaging
Tray
Description
PF7100 PMIC OTP
Detailed Description
Automotive Power Management IC for IMX8, ASIL B, 5V 5 Buck + 2 LDO
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Series
-
Packaging
Tray
Applications
i.MX Processors
Manufacturer
NXP USA Inc.
Mounting Type
Surface Mount, Wettable Flank
Package / Case
48-VFQFN Exposed Pad
Current - Supply
10µA
Voltage - Supply
2.5V ~ 5.5V
Base Product Number
MPF7100
Operating Temperature
-40°C ~ 125°C (TA)
Supplier Device Package
48-HVQFN (7x7)
AttributeValue
Series-
PackagingTray
Applicationsi.MX Processors
ManufacturerNXP USA Inc.
Mounting TypeSurface Mount, Wettable Flank
Package / Case48-VFQFN Exposed Pad
Current - Supply10µA
Voltage - Supply2.5V ~ 5.5V
Base Product NumberMPF7100
Operating Temperature-40°C ~ 125°C (TA)
Supplier Device Package48-HVQFN (7x7)

Purchase & Inquiry

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Important Notes

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2. Product availability and pricing may change over time. Our sales manager will verify the details of your order and contact you if any changes or confirmation are required.

Packaging Process

Product before packing
Step1: Product
Product in vacuum packaging
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-Static Bag
Individual packaging box
Step4: Package Boxes
Packaging box with shipping label
Step5: Bar-Code Shipping Tags
Shipping by cargo vessel
Step6: Shipping