NXP USA Inc. MPC574XG-256DS

NXP USA Inc. MPC574XG-256DS electronic component product image

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Manufacturer
Manufacturer No
MPC574XG-256DS
Packaging
Bulk
Description
MPC574XC/G EVAL BRD
Detailed Description
MPC574xC/G - e200 MCU 32-Bit Embedded Evaluation Board
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Mfr
NXP USA Inc.
Note
-
Type
MCU 32-Bit
Series
-
Contents
Board(s)
Platform
-
Packaging
Bulk
Mounting Type
Socket
Core Processor
e200
Utilized IC / Part
MPC574xC/G
Base Product Number
MPC574
Interconnect System
-
Suggested Programming Environment
-
AttributeValue
MfrNXP USA Inc.
Note-
TypeMCU 32-Bit
Series-
ContentsBoard(s)
Platform-
PackagingBulk
Mounting TypeSocket
Core Processore200
Utilized IC / PartMPC574xC/G
Base Product NumberMPC574
Interconnect System-
Suggested Programming Environment-

Purchase & Inquiry

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Payment Options

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RFQ (Request for Quote)

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Important Notes

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2. Product availability and pricing may change over time. Our sales manager will verify the details of your order and contact you if any changes or confirmation are required.

Packaging Process

Product before packing
Step1: Product
Product in vacuum packaging
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-Static Bag
Individual packaging box
Step4: Package Boxes
Packaging box with shipping label
Step5: Bar-Code Shipping Tags
Shipping by cargo vessel
Step6: Shipping