NXP USA Inc. MMZ09332BT1

NXP USA Inc. MMZ09332BT1 electronic component product image

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Manufacturer
Manufacturer No
MMZ09332BT1
Quantity
10
Availability
In Stock
Package
12-VFQFN Exposed Pad
Packaging
Tape & Reel (TR); Cut Tape (CT)
Description
IC RF AMP LTE 130MHZ-1GHZ 12QFN
Detailed Description
RF Amplifier IC LTE, TDS-CDMA, W-CDMA 130MHz ~ 1GHz 12-QFN (3x3)
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Gain
31dB
P1dB
32dBm
Series
-
RF Type
LTE, TDS-CDMA, W-CDMA
Frequency
130MHz ~ 1GHz
Packaging
Tape & Reel (TR); Cut Tape (CT)
Manufacturer
NXP USA Inc.
Noise Figure
-
Mounting Type
Surface Mount
Package / Case
12-VFQFN Exposed Pad
Test Frequency
1GHz
Current - Supply
240mA
Voltage - Supply
5V
Base Product Number
MMZ09332
Supplier Device Package
12-QFN (3x3)
AttributeValue
Gain31dB
P1dB32dBm
Series-
RF TypeLTE, TDS-CDMA, W-CDMA
Frequency130MHz ~ 1GHz
PackagingTape & Reel (TR); Cut Tape (CT)
ManufacturerNXP USA Inc.
Noise Figure-
Mounting TypeSurface Mount
Package / Case12-VFQFN Exposed Pad
Test Frequency1GHz
Current - Supply240mA
Voltage - Supply5V
Base Product NumberMMZ09332
Supplier Device Package12-QFN (3x3)

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Packaging Process

Product before packing
Step1: Product
Product in vacuum packaging
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-Static Bag
Individual packaging box
Step4: Package Boxes
Packaging box with shipping label
Step5: Bar-Code Shipping Tags
Shipping by cargo vessel
Step6: Shipping