NXP USA Inc. MM908E624AYEW

NXP USA Inc. MM908E624AYEW electronic component product image

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Manufacturer
Manufacturer No
MM908E624AYEW
Package
54-BSSOP (0.295", 7.50mm Width)
Packaging
Tube
Description
IC TRPL SWITCH MCU/LIN 54-SOIC
Detailed Description
HC08 - Mirror Control Microcontroller IC FLASH (16kB) 54-BSSOP (0.295", 7.50mm Width)
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Grade
Automotive
Series
-
RAM Size
512 x 8
Interface
SCI, SPI
Packaging
Tube
Applications
Mirror Control
Manufacturer
NXP USA Inc.
Mounting Type
Surface Mount
Number of I/O
16
Core Processor
HC08
Package / Case
54-BSSOP (0.295", 7.50mm Width)
Voltage - Supply
5.5V ~ 18V
Controller Series
908E
Base Product Number
MM908
Program Memory Type
FLASH (16kB)
DigiKey Programmable
Not Verified
Operating Temperature
-40°C ~ 125°C
Supplier Device Package
54-SOIC
AttributeValue
GradeAutomotive
Series-
RAM Size512 x 8
InterfaceSCI, SPI
PackagingTube
ApplicationsMirror Control
ManufacturerNXP USA Inc.
Mounting TypeSurface Mount
Number of I/O16
Core ProcessorHC08
Package / Case54-BSSOP (0.295", 7.50mm Width)
Voltage - Supply5.5V ~ 18V
Controller Series908E
Base Product NumberMM908
Program Memory TypeFLASH (16kB)
DigiKey ProgrammableNot Verified
Operating Temperature-40°C ~ 125°C
Supplier Device Package54-SOIC

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Packaging Process

Product before packing
Step1: Product
Product in vacuum packaging
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-Static Bag
Individual packaging box
Step4: Package Boxes
Packaging box with shipping label
Step5: Bar-Code Shipping Tags
Shipping by cargo vessel
Step6: Shipping