
NXP USA Inc. MGD3162AM550EKT

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| Attribute | Value |
|---|---|
| Mfr | NXP USA Inc. |
| Grade | Automotive |
| Series | - |
| Packaging | Tray |
| Technology | Magnetic Coupling |
| Mounting Type | Surface Mount |
| Qualification | AEC-Q100 |
| Package / Case | 32-BSSOP (0.295", 7.50mm Width) |
| Approval Agency | VDE |
| Number of Channels | 1 |
| Voltage - Isolation | - |
| Current - Peak Output | - |
| Operating Temperature | -40°C ~ 150°C |
| Rise / Fall Time (Typ) | - |
| Supplier Device Package | 32-SOIC |
| Voltage - Output Supply | 0.3V ~ 25V |
| Current - Output High, Low | - |
| Pulse Width Distortion (Max) | - |
| Voltage - Forward (Vf) (Typ) | - |
| Propagation Delay tpLH / tpHL (Max) | - |
| Common Mode Transient Immunity (Min) | 100V/ns |
Purchase & Inquiry
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Packaging Process








