NXP USA Inc. MFS2320BMBA0EP

NXP USA Inc. MFS2320BMBA0EP electronic component product image

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Manufacturer
Manufacturer No
MFS2320BMBA0EP
Quantity
10
Availability
In Stock
Package
48-VFQFN Exposed Pad
Packaging
Tray
Description
MFS2320BMBA0EP
Detailed Description
Safety System Basis Chip, ASIL B, CAN FD, 1 HV Buck + 2 HV LDO
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Series
-
Packaging
Tray
Applications
System Basis Chip
Manufacturer
NXP USA Inc.
Mounting Type
Surface Mount, Wettable Flank
Package / Case
48-VFQFN Exposed Pad
Current - Supply
30µA
Voltage - Supply
5.5V ~ 40V
Operating Temperature
-40°C ~ 125°C (TA)
Supplier Device Package
48-HVQFN (7x7)
AttributeValue
Series-
PackagingTray
ApplicationsSystem Basis Chip
ManufacturerNXP USA Inc.
Mounting TypeSurface Mount, Wettable Flank
Package / Case48-VFQFN Exposed Pad
Current - Supply30µA
Voltage - Supply5.5V ~ 40V
Operating Temperature-40°C ~ 125°C (TA)
Supplier Device Package48-HVQFN (7x7)

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Packaging Process

Product before packing
Step1: Product
Product in vacuum packaging
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-Static Bag
Individual packaging box
Step4: Package Boxes
Packaging box with shipping label
Step5: Bar-Code Shipping Tags
Shipping by cargo vessel
Step6: Shipping