10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

NXP USA Inc. MC9RS08KA1CDBR

NXP USA Inc. MC9RS08KA1CDBR electronic component product image

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Manufacturer
Manufacturer No
MC9RS08KA1CDBR
Date Code
08+
Quantity
28,900
Availability
In Stock
Package
6-VDFN Exposed Pad
Packaging
Tape & Reel (TR)
Description
IC MCU 8BIT 1KB FLASH 6DFN
Detailed Description
RS08 RS08 Microcontroller IC 8-Bit 10MHz 1KB (1K x 8) FLASH 6-DFN-EP (3x3)
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Mfr
NXP USA Inc.
Speed
10MHz
Series
RS08
RAM Size
63 x 8
Core Size
8-Bit
Packaging
Tape & Reel (TR)
EEPROM Size
-
Peripherals
LVD, POR, WDT
Connectivity
-
Mounting Type
Surface Mount
Number of I/O
2
Core Processor
RS08
Package / Case
6-VDFN Exposed Pad
Data Converters
-
Oscillator Type
Internal
Base Product Number
MC9RS08
Program Memory Size
1KB (1K x 8)
Program Memory Type
FLASH
DigiKey Programmable
Not Verified
Operating Temperature
-40°C ~ 85°C (TA)
Supplier Device Package
6-DFN-EP (3x3)
Voltage - Supply (Vcc/Vdd)
1.8V ~ 5.5V
AttributeValue
MfrNXP USA Inc.
Speed10MHz
SeriesRS08
RAM Size63 x 8
Core Size8-Bit
PackagingTape & Reel (TR)
EEPROM Size-
PeripheralsLVD, POR, WDT
Connectivity-
Mounting TypeSurface Mount
Number of I/O2
Core ProcessorRS08
Package / Case6-VDFN Exposed Pad
Data Converters-
Oscillator TypeInternal
Base Product NumberMC9RS08
Program Memory Size1KB (1K x 8)
Program Memory TypeFLASH
DigiKey ProgrammableNot Verified
Operating Temperature-40°C ~ 85°C (TA)
Supplier Device Package6-DFN-EP (3x3)
Voltage - Supply (Vcc/Vdd)1.8V ~ 5.5V

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Packaging Process