NXP USA Inc. MC33GD3100A3EKR2

NXP USA Inc. MC33GD3100A3EKR2 electronic component product image

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Manufacturer
Manufacturer No
MC33GD3100A3EKR2
Availability
In Stock
Package
32-BSSOP (0.295", 7.50mm Width)
Packaging
Tape & Reel (TR)
Description
IC GATE DRVR HALF-BRIDGE 32SOIC
Detailed Description
Half-Bridge Gate Driver IC 32-SOIC
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Grade
Automotive
Series
-
Gate Type
IGBT, MOSFET (N-Channel)
Packaging
Tape & Reel (TR)
Input Type
-
Channel Type
Single
Manufacturer
NXP USA Inc.
Mounting Type
Surface Mount
Qualification
AEC-Q100
Package / Case
32-BSSOP (0.295", 7.50mm Width)
Voltage - Supply
3.3V
Number of Drivers
1
Base Product Number
MC33GD3100
DigiKey Programmable
Not Verified
Driven Configuration
Half-Bridge
Operating Temperature
-40°C ~ 125°C (TA)
Rise / Fall Time (Typ)
-
Supplier Device Package
32-SOIC
Logic Voltage - VIL, VIH
-
Current - Peak Output (Source, Sink)
15A, 15A
AttributeValue
GradeAutomotive
Series-
Gate TypeIGBT, MOSFET (N-Channel)
PackagingTape & Reel (TR)
Input Type-
Channel TypeSingle
ManufacturerNXP USA Inc.
Mounting TypeSurface Mount
QualificationAEC-Q100
Package / Case32-BSSOP (0.295", 7.50mm Width)
Voltage - Supply3.3V
Number of Drivers1
Base Product NumberMC33GD3100
DigiKey ProgrammableNot Verified
Driven ConfigurationHalf-Bridge
Operating Temperature-40°C ~ 125°C (TA)
Rise / Fall Time (Typ)-
Supplier Device Package32-SOIC
Logic Voltage - VIL, VIH-
Current - Peak Output (Source, Sink)15A, 15A

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Packaging Process

Product before packing
Step1: Product
Product in vacuum packaging
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-Static Bag
Individual packaging box
Step4: Package Boxes
Packaging box with shipping label
Step5: Bar-Code Shipping Tags
Shipping by cargo vessel
Step6: Shipping