10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

NXP USA Inc. LPC3143FET180,551

NXP USA Inc. LPC3143FET180,551 electronic component product image

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Manufacturer
Manufacturer No
LPC3143FET180,551
Date Code
23+
Quantity
2,458
Availability
In Stock
Package
180-TFBGA
Packaging
Tray
Description
IC MCU 16/32BIT ROMLESS 180TFBGA
Detailed Description
ARM926EJ-S LPC3100 Microcontroller IC 16/32-Bit 270MHz ROMless 180-TFBGA (12x12)
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Mfr
NXP USA Inc.
Speed
270MHz
Series
LPC3100
RAM Size
192K x 8
Core Size
16/32-Bit
Packaging
Tray
EEPROM Size
-
Peripherals
DMA, I2S, LCD, PWM, WDT
Connectivity
EBI/EMI, I2C, IrDA, Memory Card, PCM, SPI, UART/USART, USB OTG
Mounting Type
Surface Mount
Number of I/O
20
Core Processor
ARM926EJ-S
Package / Case
180-TFBGA
Data Converters
A/D 4x10b
Oscillator Type
External
Base Product Number
LPC3143
Program Memory Size
-
Program Memory Type
ROMless
DigiKey Programmable
Not Verified
Operating Temperature
-40°C ~ 85°C (TA)
Supplier Device Package
180-TFBGA (12x12)
Voltage - Supply (Vcc/Vdd)
1.1V ~ 3.6V
AttributeValue
MfrNXP USA Inc.
Speed270MHz
SeriesLPC3100
RAM Size192K x 8
Core Size16/32-Bit
PackagingTray
EEPROM Size-
PeripheralsDMA, I2S, LCD, PWM, WDT
ConnectivityEBI/EMI, I2C, IrDA, Memory Card, PCM, SPI, UART/USART, USB OTG
Mounting TypeSurface Mount
Number of I/O20
Core ProcessorARM926EJ-S
Package / Case180-TFBGA
Data ConvertersA/D 4x10b
Oscillator TypeExternal
Base Product NumberLPC3143
Program Memory Size-
Program Memory TypeROMless
DigiKey ProgrammableNot Verified
Operating Temperature-40°C ~ 85°C (TA)
Supplier Device Package180-TFBGA (12x12)
Voltage - Supply (Vcc/Vdd)1.1V ~ 3.6V

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Packaging Process