NXP USA Inc. LPC1830FET256

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Manufacturer

NXP USA Inc.

Manufacturer No

LPC1830FET256

Package

256-LBGA

Packaging

Tray

Description

IC MCU 32BIT ROMLESS 256LBGA

Detailed Description

ARM® Cortex®-M3 - Microcontroller IC 32-Bit 180MHz ROMless 256-LBGA (17x17)

Payment

Delivery

Mfr

NXP USA Inc.

Speed

180MHz

Series

-

RAM Size

200K x 8

Core Size

32-Bit

Packaging

Tray

EEPROM Size

-

Peripherals

Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT

Connectivity

CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG

Mounting Type

Surface Mount

Number of I/O

164

Core Processor

ARM® Cortex®-M3

Package / Case

256-LBGA

Data Converters

A/D 8x10bSAR; D/A 1x10b

Oscillator Type

Internal

Base Product Number

LPC1830

Program Memory Size

-

Program Memory Type

ROMless

DigiKey Programmable

Not Verified

Operating Temperature

-40°C ~ 85°C (TA)

Supplier Device Package

256-LBGA (17x17)

Voltage - Supply (Vcc/Vdd)

2.2V ~ 3.6V

Attribute	Value
Mfr	NXP USA Inc.
Speed	180MHz
Series	-
RAM Size	200K x 8
Core Size	32-Bit
Packaging	Tray
EEPROM Size	-
Peripherals	Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Connectivity	CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Mounting Type	Surface Mount
Number of I/O	164
Core Processor	ARM® Cortex®-M3
Package / Case	256-LBGA
Data Converters	A/D 8x10bSAR; D/A 1x10b
Oscillator Type	Internal
Base Product Number	LPC1830
Program Memory Size	-
Program Memory Type	ROMless
DigiKey Programmable	Not Verified
Operating Temperature	-40°C ~ 85°C (TA)
Supplier Device Package	256-LBGA (17x17)
Voltage - Supply (Vcc/Vdd)	2.2V ~ 3.6V

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