NXP USA Inc. BFU730LXZ

NXP USA Inc. BFU730LXZ electronic component product image

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Manufacturer
Manufacturer No
BFU730LXZ
Availability
In Stock
Package
3-XFDFN
Packaging
Tape & Reel (TR); Cut Tape (CT)
Description
RF TRANS NPN 3V 53GHZ DFN1006C-3
Detailed Description
RF Transistor NPN 3V 30mA 53GHz 160mW Surface Mount DFN1006C-3
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Gain
15.8dB
Series
-
Packaging
Tape & Reel (TR); Cut Tape (CT)
Power - Max
160mW
Manufacturer
NXP USA Inc.
Mounting Type
Surface Mount
Package / Case
3-XFDFN
Transistor Type
NPN
Base Product Number
BFU730
Operating Temperature
-
Frequency - Transition
53GHz
Supplier Device Package
DFN1006C-3
Noise Figure (dB Typ @ f)
0.75dB @ 6GHz
Current - Collector (Ic) (Max)
30mA
DC Current Gain (hFE) (Min) @ Ic, Vce
205 @ 2mA, 3V
Voltage - Collector Emitter Breakdown (Max)
3V
AttributeValue
Gain15.8dB
Series-
PackagingTape & Reel (TR); Cut Tape (CT)
Power - Max160mW
ManufacturerNXP USA Inc.
Mounting TypeSurface Mount
Package / Case3-XFDFN
Transistor TypeNPN
Base Product NumberBFU730
Operating Temperature-
Frequency - Transition53GHz
Supplier Device PackageDFN1006C-3
Noise Figure (dB Typ @ f)0.75dB @ 6GHz
Current - Collector (Ic) (Max)30mA
DC Current Gain (hFE) (Min) @ Ic, Vce205 @ 2mA, 3V
Voltage - Collector Emitter Breakdown (Max)3V

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Packaging Process

Product before packing
Step1: Product
Product in vacuum packaging
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-Static Bag
Individual packaging box
Step4: Package Boxes
Packaging box with shipping label
Step5: Bar-Code Shipping Tags
Shipping by cargo vessel
Step6: Shipping