NXP Semiconductors XC56309AG100AR2
Image is only for reference
| Attribute | Value |
|---|---|
| CAN | 0 |
| HTS | 8542.31.00.35 |
| I2C | 0 |
| I2S | 0 |
| SPI | 0 |
| USB | 0 |
| PPAP | No |
| SVHC | Yes |
| UART | 0 |
| USART | 0 |
| EU RoHS | Compliant |
| Ethernet | 0 |
| Mounting | Surface Mount |
| RAM Size | 384KB |
| ECCN (US) | 3A991a.2. |
| Packaging | Tape and Reel |
| Pin Count | 144 |
| Automotive | No |
| Lead Shape | Gull-wing |
| Device Core | DSP56300 |
| PCB changed | 144 |
| Availability | No Stock Available |
| Package Width | 20 |
| Interface Type | SCI |
| Package Height | 1.45(Max) |
| Package Length | 20 |
| Programmability | No |
| Supplier Package | LQFP |
| Program Memory Type | ROM |
| Data Bus Width (bit) | 24 |
| Standard Package Name | QFP |
| Numeric and Arithmetic Format | Fixed-Point |
| Device Input Clock Speed (MHz) | 100 |
| Maximum Operating Temperature (°C) | 105 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Supply Voltage (V) | 3.6 |
| Minimum Operating Supply Voltage (V) | 3 |
| Typical Operating Supply Voltage (V) | 3.3 |
| Device Million Instructions per Second (MIPS) | 100 |
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Packaging Process
