10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

NXP Semiconductors TEA1620P/N1,112

NXP Semiconductors TEA1620P/N1,112 electronic component product image

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Manufacturer
Manufacturer No
TEA1620P/N1,112
Package
8-DIP (0.300", 7.62mm)
Packaging
Tube
Description
IC OFFLINE SWITCH FLYBACK 8DIP
Detailed Description
Converter Offline Flyback Topology 10kHz ~ 200kHz 8-DIP
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Series
STARplug™
Topology
Flyback
Packaging
Tube
Duty Cycle
75%
Manufacturer
NXP Semiconductors
Mounting Type
Through Hole
Package / Case
8-DIP (0.300", 7.62mm)
Control Features
Frequency Control
Fault Protection
Current Limiting, Over Temperature, Short Circuit
Output Isolation
Isolated
Internal Switch(s)
Yes
Voltage - Start Up
9.5 V
Voltage - Breakdown
650V
Frequency - Switching
10kHz ~ 200kHz
Operating Temperature
-20°C ~ 85°C (TA)
Supplier Device Package
8-DIP
Voltage - Supply (Vcc/Vdd)
7.5V ~ 40V
AttributeValue
SeriesSTARplug™
TopologyFlyback
PackagingTube
Duty Cycle75%
ManufacturerNXP Semiconductors
Mounting TypeThrough Hole
Package / Case8-DIP (0.300", 7.62mm)
Control FeaturesFrequency Control
Fault ProtectionCurrent Limiting, Over Temperature, Short Circuit
Output IsolationIsolated
Internal Switch(s)Yes
Voltage - Start Up9.5 V
Voltage - Breakdown650V
Frequency - Switching10kHz ~ 200kHz
Operating Temperature-20°C ~ 85°C (TA)
Supplier Device Package8-DIP
Voltage - Supply (Vcc/Vdd)7.5V ~ 40V

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Packaging Process