10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

NXP Semiconductors TDF8599TH/N2,512

NXP Semiconductors TDF8599TH/N2,512 electronic component product image

Image is only for reference

Manufacturer
Manufacturer No
TDF8599TH/N2,512
Package
36-BSSOP (0.433", 11.00mm Width) Exposed Pad
Packaging
Tube
Description
IC AUDIO AMP D 36-HSOP
Detailed Description
Amplifier IC 1-Channel (Mono) or 2-Channel (Stereo) Class D 36-HSOP
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Type
Class D
Series
-
Features
Depop, Differential Inputs, I2C, Mute, Short-Circuit and Thermal Protection
Packaging
Tube
Output Type
1-Channel (Mono) or 2-Channel (Stereo)
Manufacturer
NXP Semiconductors
Mounting Type
Surface Mount
Package / Case
36-BSSOP (0.433", 11.00mm Width) Exposed Pad
Voltage - Supply
8V ~ 18V
Operating Temperature
-40°C ~ 85°C (TA)
Supplier Device Package
36-HSOP
Max Output Power x Channels @ Load
85W x 1 @ 1Ohm; 70W x 2 @ 2Ohm
AttributeValue
TypeClass D
Series-
FeaturesDepop, Differential Inputs, I2C, Mute, Short-Circuit and Thermal Protection
PackagingTube
Output Type1-Channel (Mono) or 2-Channel (Stereo)
ManufacturerNXP Semiconductors
Mounting TypeSurface Mount
Package / Case36-BSSOP (0.433", 11.00mm Width) Exposed Pad
Voltage - Supply8V ~ 18V
Operating Temperature-40°C ~ 85°C (TA)
Supplier Device Package36-HSOP
Max Output Power x Channels @ Load85W x 1 @ 1Ohm; 70W x 2 @ 2Ohm

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Packaging Process