10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

NXP Semiconductors TDA10027HN/C1,518

NXP Semiconductors TDA10027HN/C1,518 electronic component product image

Image is only for reference

Manufacturer
Manufacturer No
TDA10027HN/C1,518
Package
HVQFN EP
Packaging
Tape and Reel
Description
Dmod 64-Pin HVQFN EP T/R
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
HTS
COMPONENTS
PPAP
No
EU RoHS
Compliant
Mounting
Surface Mount
ECCN (US)
3A991c.2.
Packaging
Tape and Reel
Pin Count
64
Automotive
No
Lead Shape
No Lead
Device Type
Demodulator
PCB changed
64
Availability
No Stock Available
Package Width
9
Package Height
0.83
Package Length
9
Programmability
No
Supplier Package
HVQFN EP
Standard Package Name
QFN
Maximum Power Dissipation (mW)
360
Maximum Operating Temperature (°C)
120
Maximum Operating Supply Voltage (V)
1.3|3.6
Minimum Operating Supply Voltage (V)
1.15|3
Typical Operating Supply Voltage (V)
1.2|3.3
AttributeValue
HTSCOMPONENTS
PPAPNo
EU RoHSCompliant
MountingSurface Mount
ECCN (US)3A991c.2.
PackagingTape and Reel
Pin Count64
AutomotiveNo
Lead ShapeNo Lead
Device TypeDemodulator
PCB changed64
AvailabilityNo Stock Available
Package Width9
Package Height0.83
Package Length9
ProgrammabilityNo
Supplier PackageHVQFN EP
Standard Package NameQFN
Maximum Power Dissipation (mW)360
Maximum Operating Temperature (°C)120
Maximum Operating Supply Voltage (V)1.3|3.6
Minimum Operating Supply Voltage (V)1.15|3
Typical Operating Supply Voltage (V)1.2|3.3

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Important Notes

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2. Product availability and pricing may change over time. Our sales manager will verify the details of your order and contact you if any changes or confirmation are required.

Packaging Process