10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

NXP Semiconductors NVT2008BQZ

NXP Semiconductors NVT2008BQZ electronic component product image

Image is only for reference

Manufacturer
Manufacturer No
NVT2008BQZ
Date Code
22+
Quantity
6,000
Availability
In Stock
Package
DHVQFN EP
Packaging
Tape and Reel
Description
Voltage Level Translator 8-CH Bidirectional 20-Pin DHVQFN EP T/R
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
HTS
EA
PPAP
No
SVHC
Yes
EU RoHS
Compliant
Mounting
Surface Mount
ECCN (US)
EAR99
Packaging
Tape and Reel
Pin Count
20
Automotive
No
Lead Shape
No Lead
Output Type
Open Drain|Push-Pull
PCB changed
20
Availability
In Stock
Channel Type
Bidirectional
Package Width
2.5
Logic Function
Voltage Level Translator
Package Height
0.88
Package Length
4.5
Supplier Package
DHVQFN EP
Number of Channels
8
Standard Package Name
QFN
Manufacturer Lead Time
16 weeks
Maximum Operating Temperature (°C)
85
Minimum Operating Temperature (°C)
-40
Maximum Operating Supply Voltage (V)
3.6/5.5
Minimum Operating Supply Voltage (V)
1/1.8
Typical Operating Supply Voltage (V)
3.3/5|3.3|2.5/5|2.5/3.3|2.5|1.8/5|1.8/3.3|1.8/2.5
AttributeValue
HTSEA
PPAPNo
SVHCYes
EU RoHSCompliant
MountingSurface Mount
ECCN (US)EAR99
PackagingTape and Reel
Pin Count20
AutomotiveNo
Lead ShapeNo Lead
Output TypeOpen Drain|Push-Pull
PCB changed20
AvailabilityIn Stock
Channel TypeBidirectional
Package Width2.5
Logic FunctionVoltage Level Translator
Package Height0.88
Package Length4.5
Supplier PackageDHVQFN EP
Number of Channels8
Standard Package NameQFN
Manufacturer Lead Time16 weeks
Maximum Operating Temperature (°C)85
Minimum Operating Temperature (°C)-40
Maximum Operating Supply Voltage (V)3.6/5.5
Minimum Operating Supply Voltage (V)1/1.8
Typical Operating Supply Voltage (V)3.3/5|3.3|2.5/5|2.5/3.3|2.5|1.8/5|1.8/3.3|1.8/2.5

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Packaging Process