NXP Semiconductors NTB0104GU12,115
Image is only for reference
| Attribute | Value |
|---|---|
| HTS | 8542.39.00.90 |
| PPAP | No |
| EU RoHS | Compliant |
| Mounting | Surface Mount |
| ECCN (US) | EAR99 |
| Packaging | Tape and Reel |
| Pin Count | 12 |
| Automotive | No |
| Lead Shape | No Lead |
| Output Type | 3-State |
| PCB changed | 12 |
| Availability | In Stock |
| Channel Type | Bidirectional |
| Package Width | 1.7 |
| Logic Function | Voltage Level Translator |
| Package Height | 0.45(Max) |
| Package Length | 2 |
| Supplier Package | XQFN |
| Number of Channels | 4 |
| Standard Package Name | QFN |
| Manufacturer Lead Time | 16 weeks |
| Minimum Latch-Up Current (mA) | 100 |
| Maximum Quiescent Current (mA) | 0.04 |
| Maximum Operating Temperature (°C) | 125 |
| Minimum Operating Temperature (°C) | -40 |
| Absolute Propagation Delay Time (ns) | 340 |
| Maximum Operating Supply Voltage (V) | 3.6/5.5 |
| Minimum Operating Supply Voltage (V) | 1.2/1.65 |
| Typical Operating Supply Voltage (V) | 1.8|1.8/2.5|1.8/3.3|1.8/5|2.5|2.5/3.3|2.5/5|3.3|3.3/5 |
| Maximum Low Level Output Current (mA) | 0.02 |
| Maximum High Level Output Current (mA) | -0.02 |
| Maximum Propagation Delay Time @ Maximum CL (ns) | 5.9(Typ)@[email protected] |
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Packaging Process
